Flextura sputter

for high quality and high uniformity layers of metals and dielectrics

Flextura Sputter

The Flextura Sputter is a configurable sputtering platform designed to accommodate different target materials, substrate sizes and process requirements. Its modular architecture allows sputtering configurations to be tailored to the application — from single-material deposition to multi-target processes with several smaller targets.

The Flextura modules can start as a standalone batch or single-substrate solution and later be integrated into the Flextura Cluster platform as production capacity and automation requirements increase. This allows you to expand your manufacturing capabilities in stages, adding capacity and automation as your process and business grow.

Let your manufacturing facility grow with your capital investment in the easiest possible way.

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Flextura Sputter Highlights

The Flextura Sputter module enables high quality and high uniformity layers of metals and dielectrics.

The systems can support up everything from small chips up to 300mm wafers and can be configured with several RF and/or DC magnetron sources in several system configurations like planar or confocal sputtering.

Very small footprint and a clean design
Process frame for epitaxial growth of thin films up to 1000°C
Fully automated process control with advanced data logging
Strong reliable 24/7 production tools
SECS/GEM option

Sputter processes

The Flextura Sputter modules can be equipped with single or multiple magnetrons for planar or confocal sputtering, allowing the deposition configuration to be tailored to the substrate, target material and required film properties.

Multiple magnetrons enable multi-material deposition and co-sputtering, while reactive process configurations can be used to deposit compound films such as oxides and nitrides. The magnetron arrangement, target geometry and substrate movement can be selected to achieve the required coating uniformity and process performance.

Whether you need straightforward metal metallisation, multi-layer structures or complex reactive sputtering processes, we have the experience to guide you towards the best solution.

Circular scanning magnetron (CSM) sputter module
- High rate deposition of one material
Confocal sputtering
- Multiple magnetrons
- Multilayers in one module
- Co-sputtering
Linear sputtering
- Single or dual magnetrons
- Planar or rotatable setup
HiPIMS sputtering module
- High aspect ratio metallisation
- Layer property tuning
DC, pDC, and RF, Bipolar magnetron sputtering
Reactive and nonreactive sputtering

Choose substrate loading

You can run the Flextura module as a batch system, with a single substrate load lock, or plug it into our Flextura Cluster platform.

In other words, you can start from a highly flexible standalone system and later add additional processes and analytics to bring your thin film research to new heights. Save valuable clean room space and automate your deposition processes without compromising flexibility.

Prefer independent deposition systems, then the Flextura PVD module in combination with a single substrate load lock is a great versatile high-quality tool.

Batch system
Single substrate loading
Cassette loading
Cluster system

Start a conversation

Whether you are specifying a new system, scaling an existing process, or evaluating PVD for a new application — contact the Polyteknik team for a technical discussion tailored to your requirements.

+45 9689 2800