Tornado Compact Lab

Available with evaporation or sputtering sources

The compact PVD system

The Tornado Compact LAB is a compact deposition system designed as a versatile and reliable lab workhorse for thin-film research and development.

Its easy access, intuitive operation and high process repeatability make it well suited to both teaching environments and advanced research. The process chamber and control cabinet are integrated into a single compact unit, providing a space-efficient solution that is easy to install and operate in the laboratory.

The system combines a small footprint with the process control and repeatability required for reliable thin-film development, making it a practical platform for both new users and experienced researchers.

Get in touch with our experts

P: +45 9689 2800

A versatile PVD platform for research and development

The Tornado is a compact and versatile PVD system for thin-film research and process development, available with either evaporation or sputtering sources. Its compact configuration combines flexible deposition capabilities with fully automated process control and data logging through Polyteknik’s control software.

A manual load lock can be added for faster substrate exchange and increased process throughput, making the Tornado well suited to applications ranging from general thin-film R&D to more specialised material and device development.

Typical applications include photovoltaic materials, multilayer ohmic contacts, oxide and nitride coatings, graded cermet layers, metal electrode coatings, and hydrophobic or hydrophilic ceramic layers.

Main features of the Tornado Compact Lab

Tornado sputtering

Up to five 2-3” magnetrons
Up to three 4” magnetrons
Supports DC, pDC, RF, and HiPIMS sputtering
Single target or multi target co-deposition

Tornado evaporation

Metallisation
Lift-off processes
Optionally combined with thermal evaporator
E-beam and thermal evaporation

Single substrate stage

Continuous 360° or indexed rotation
Backside resistive heating up to 400°C
Water cooled substrate stage with tilt (+/-45deg)
Single substrate load lock
Typical substrate size up to 4” (100mm)
RF/DC Bias feeding

Batch substrate fixture

Max diameter 300mm
Wafer capacity: 8×3” (76,2mm), 5×4” (100mm)
RF/DC Bias feeding

Interested in the Tornado Compact LAB for your R&D projects?

+45 9689 2800