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PVD Systems for advanced thin film research and production

Polyteknik PVD systems are installed in research institutes, pilot lines, and production environments, supporting demanding thin film applications where performance, repeatability, and scalability are critical.

PVD systems for every stage of production

Polyteknik designs and manufactures PVD systems that support thin film processes from early-stage research through to high-volume industrial production.

The platform portfolio spans compact laboratory tools, modular R&D clusters, and fully automated production systems — all built around a common architecture that allows processes to scale without re-qualification.

Systems are installed and in active use at universities, national research institutes, semiconductor pilot lines, and volume fabs.

Each system is designed and assembled at Polyteknik’s production facility in Denmark.

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PVD Systems

Each platform is optimised for a specific stage of development or production. All process modules within the Flextura® family are compatible with the same cluster architecture.

Flextura 300 Cluster

High throughput for 300 mm wafers. Industrial production with full automation and SECS/GEM.
Flextura 300 Cluster

Flextura 200 Cluster

Flexible production and future-ready. Scalable cluster for 200 mm substrates.
Flextura 200 Cluster

Flextura Sputter

Versatile sputtering process modules for integration into a cluster or standalone use.
Flextura Sputter

Flextura Evaporator

High uniformity thermal and e-beam evaporation for demanding deposition requirements
Flextura Evaporator

Flextura R&D

Advanced thin film research with flexible process configuration for smaller substrates
Flextura R&D

Infinity VB

In-line vertical sputtering platform designed for highvolume coating on large substrates.
Infinity VB

Tornado Compact Lab

A high-quality entry-level deposition system for compact lab environments.
Tornado Compact Lab

Supporting advanced device manufacturing

Polyteknik PVD systems are deployed in the development and production of devices across high-performance semiconductor markets.

Typical applications include thin film stack deposition for photonic integrated circuits, piezoelectric layers for MEMS and BAW/FBAR filter fabrication, superconducting films for quantum devices, ohmic and Schottky metallization’s for power devices, and functional oxide layers for sensors and wireless components.

Market areas

  • Photonics & Photonic Integrated Circuits (PIC)
  • Quantum devices & superconducting circuits
  • MEMS & sensors
  • Wireless devices (BAW, SAW, FBAR)
  • Power electronics (GaN, SiC)

The Flextura® Platform

The Flextura® platform is a modular PVD architecture designed to support every stage from material exploration to volume production. Process modules — sputtering, evaporation, etch, annealing — can be integrated into a cluster or operated as standalone tools, with single-substrate, cassette, or batch load-lock configurations.

The same process architecture applies across all Flextura system sizes, from the R&D tool to the 300 mm production cluster. This means processes developed at research scale can be transferred to production without fundamental re-engineering.

Scalable capacity

Fully upgradable from a single process module to a full cluster. Designed for continuous 24/7 production operation.

CMOS compatibility

Built for the cleanliness and materials control demanded by advanced semiconductor fabrication.

Smart automation

Fully automated substrate handling with advanced data logging. SECS/GEM, MES integration, and E84 handshake available.

Process flexibility

Sputtering, evaporation, etch, and annealing within a single platform. Multiple technologies can be combined in one run.

High-temperature deposition

Substrate heating to 1000 °C for epitaxial growth and high-performance material processing.

Advanced techniques

HiPIMS, magnetron sputter epitaxy, gradient sputtering, GLAD, and dynamic in-situ process control via PEM or RGA.

Deposition technologies

Polyteknik systems are designed so that a process developed on the Flextura R&D platform scales directly to the Flextura Sputter or Evaporator module, and from there to the Flextura 200 or 300 Cluster — without changing the fundamental deposition architecture. This reduces process re-qualification time at each transition.

Sputtering (DC, RF, reactive) Versatile and scalable. Suitable for metals, oxides, nitrides, and compound materials. Reactive sputtering with dynamic in-situ stoichiometry control via plasma emission monitoring.

Thermal evaporation High-purity, ultra-uniform films. Suitable for low-contamination metallisation and lift-off processes.

Electron beam evaporation Enables deposition of high-melting-point materials including refractory metals and dielectric oxides.

GLAD — Glancing Angle Deposition Produces structured nanofilms with controlled porosity and morphology by varying substrate tilt and rotation during deposition.

Celebrating 10 years anniversary of the Flextura in 2026

The Flextura® PVD platform is deployed across a wide range of environments and configurations — from high-volume fabs to specialised research clusters.

University and research institute installations give a representative picture of platform flexibility: Aalborg University operates a dual-chamber Flextura 200 with separate e-beam evaporation and sputtering modules in their NanoLab cleanroom facility; Politecnico di Milano runs a three-chamber sputtering cluster configuration at PoliHub, their on-campus fabrication facility.

At SINTEF Industry, one of Europe’s largest independent research organisations, a Flextura R&D system was specified for advanced materials research requiring broad process flexibility.

Senior Research Scientist Marit Stange describes the requirement: “We needed a system with a high level of flexibility, where we could explore deposition of a wide range of materials and material combinations. It was essential that the equipment did not limit the research, but rather enabled it.”

Read the case story

30+ years of thin film expertise Founded in 1995, Polyteknik has more than three decades of combined experience in PVD equipment development, thin film process engineering, and contract coating. The company grew from a coating service supplier into an internationally recognised equipment manufacturer.

Made in Denmark All systems are designed, assembled, and tested at Polyteknik’s facility in Denmark. In-house engineering, cleanroom and manufacturing enables close quality control and rapid response to customer requirements.

Designed to be upgraded The Flextura® platform is built for long-term use. Systems can be upgraded with additional process modules, extended substrate handling, or new deposition capabilities as requirements evolve.

Long-term partnership Polyteknik offers service contracts, spare parts supply, remote diagnostics, and on-site support. A dedicated service and maintenance programme keeps installed systems operating to specification throughout their working life.

Service and maintenance

Polyteknik supports installed systems through their full working life. Service offerings include preventive maintenance contracts, remote diagnostics, spare parts supply, process support, and system upgrades. Contact the service team directly via sales@polyteknik.dk or visit the Service and Maintenance page.
Service
service

Latest insights

SINTEF Industry & Polyteknik

SINTEF Industry & Polyteknik A decade of thin‑film research built on the Flextura PVD platform — designed to grow.  SINTEF…

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Whether you are specifying a new system, scaling an existing process, or evaluating PVD for a new application — contact the Polyteknik team for a technical discussion tailored to your requirements.
Contact us
+45 9689 2800
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